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High Thermal Conductivity: AlN ceramic offers excellent thermal conductivity, providing efficient heat dissipation for laser chips.
High-Reliability Packaging: Pre-deposited AuSn thin film improves die bonding quality and ensures long-term operational reliability.
Thermal Expansion Matching: The thermal expansion coefficient closely matches materials such as Si and GaAs, effectively reducing thermal stress.
Widely used in high-power laser packaging and optical communications scenarios such as silicon photonics transceiver modules, ELSFP modules, CPO (co-packaged optics).
Key Specifications
Part No.
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Product Code
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Dimensions
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AuSn Thickness
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Melting Point
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Download | |
|---|---|---|---|---|---|---|
| FL-AMC-4057 | AMC000005 | 5.75x4.05x0.48 mm | 4.5 μm | 280-320 ℃ |
|
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| FL-AMC-4557 | AMC000002 | 5.75x4.50x0.49 mm | 4.5 μm | 280-320 ℃ |
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